BOJACK Solder Paste Flux No Clean Free Environmentally Friendly Soldering Flux Paste Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g)

BOJACK 146g solder paste, lead-free environmentally friendly solder paste, no-clean flux, powerful soldering grease soldering, special BGA repair and soldering helper for CPU disassembly and assembly Specifiction Weight: 5.15 oz/146 g Paste: Milky white Packaging: Paste*1 Features: Easy tin application/Lead-free and acid-free/Perfectly smooth/Convenient and no-cleaning/Non-corrosive/Highly active/Prevent oxidation AdvantageFlux plays a crucial role in soldering BGAs. It covers substrate and solder surfaces, promotes uniform heat transfer and reacts with oxides, controls oxidation and improves solder joint quality. Non-corrosive, lead-free solder pastes are IC and PCB friendly, easy to handle and quick to clean. Rosin, with low corrosiveness, does not affect circuit components. The flux removes oxide layers for optimal soldering results, prevents reoxidation during soldering and reduces solder surface tension. Instructions for use: 1. When welding, apply this product on the surface of the welding metal or directly stick the flux paste with a welding wire, and then heat the soldering iron for welding; 2. After welding, a small amount of residue needs to be scrubbed promptly with other organic solvents such as ethanol or isopropyl alcohol. Note: Please keep it sealed after opening and use. Recommend:maintain low temperature storage of 2-8℃ to avoid affecting the next use; Environment: temperature 20~25℃, humidity 35~65%.

• [Properties] Milky white; Gross weight 5.15 ounces/146 grams (Large Capacity)
• [Safe and non-toxic]Contains natural rosin and synthetic resin, acid-free, lead-free, no cleaning and no irritating smell.
• [Efficient Performance]Precision electronic chip level welding. The soldering flux paste is non-corrosive and oxygen-resistant for gold-copper alloy substrate soldering irons, and has zero damage to IC and PCB, helping you to carry out mobile phone and PC boards without hindrance.
• [Easy to use]Fine and moist and easy to use. This product is high-purity commonly used for welding. It has high joint strength, less residue and no agglomeration after emulsification and grinding by high-tech machines，enhancing the fluidity and wettability of solder and help your welding to be more stable and reliable.
• [Main purpose]Comply with the requirements of medium and high products/BGA special welding and repair; suitable for circuit boards, sensors, wires, motors, electronic components, SMT repair and BGA welding process, etc.