2-Layer Double-Sided Flexible Copper-Clad Laminate(Cu18μm/TPI25μm/Cu18μm x 9.8in)-5m-High Conductivity & Flexibility, Wearable Devices, and Automotive Electronics, 5G Circuit Board (1, 5m)
$89.99
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Product details
| Management number | 221494543 | Release Date | 2026/05/03 | List Price | $36.00 | Model Number | 221494543 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Exceptional Performance: Featuring a robust construction of 18μm copper (Cu) combined with a 25μm Thermal Paper Insulation (TPI) layer, our Copper Clad Laminate ensures unparalleled performance for various applications, particularly in 5G technologies.
- Versatile Size: Measuring 250mm x 5m, this laminate offers generous material for a wide range of projects, making it the perfect choice for electronics, wearable devices, automotive electronics, and advanced 5G circuit board applications.
- Superior Conductivity: With its outstanding conductivity and flexibility, our Copper Clad Laminate enables intricate designs and enhances functionality, catering to the evolving demands of cutting-edge technology and high-performance applications.
- Ideal for High-Tech Projects: Whether developing next-generation wearable devices or automotive components, this flexible laminate is engineered to meet the rigorous standards of modern technological applications, ensuring reliability and durability.
- Specification: Measuring 250mm x 5m, 18μm copper (Cu), 25μm Thermal Paper Insulation (TPI), One roll per box
| Color | Copper |
|---|---|
| Material | Cu |
| Item Form | Cu |
| Brand Name | CIVEN METAL |
| Item Shape | Roll |
| Part Number | Copper-Clad Laminate |
| Manufacturer | CIVEN METAL |
| Item Thickness | 0.06 Millimeters |
| Number of Items | 1 |
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